미국 항공기 기내 인터넷 공급업체 Gogo의 최근 실적발표에서 확인 된 내용입니다.

항공용 5G망 구축 및 개발업체로 Airspan Networks를 선정했었는데

Airspan Networks가 삼성의 칩 제조 결함으로 칩 공급이 지연될 것이라 통보해왔다고 합니다.

- 원문

"Our 5G supplier Airspan informed us that there was a flaw in Samsung's fabrication of our 5G chip that locked the chip in test mode," explained Gogo CEO Oakleigh Thorne during his company's earnings conference call this week. "We have just received final commitments from Airspan and their chip supplier that Samsung will need to respin the entire chip. Airspan will now receive the chip in Q2 next year. We will test fly in Q3 and that should put us all on track for commercial launch in Q4."